Automatic Ball Wire Bonders MPE-6000 Plus

Specification

• Application：Discrete,Microwave module, Laser, Optical information devices, IC, LED
• Bonding Accuracy：±3μm@3sigma
• Bonding Area：X=60,Y=70(LFwidth≤80)
• Lengthof Wire Bonding：≤7mm
• Min Bond Pad Pitch：45μm
• Loop Types：Q-Loop,SQ-Loop, BGA-TWS
• Wire Bonding Capacity：30,000 wires for Step Repeat Matrix
• Spool Diameter：50(2inch)
• Wire Material：Glod wire(15~50μm),copper wire, palladium plating copper wire, alloy wire, Silver wire
• Bonding Speed：45ms/cycle time
• Optical System：Programmable auto-zoom:2~4 times continuous zoom,1.6~3.6 times is optional
• Basic OS：Windows
• Weight：650Kg