Automatic Ball Wire Bonders MPE-6000PC

Specification

• Application：Microwave module,Laser, Optical information devices, sensors
• Bonding Accuracy：±3μm@3sigma
• Bonding Area：X=60mm,Y=46mm
• Length of Wire Bonding：≤7mm
• Loop Height Accuracy：±25.4μm
• Bond Force：0~360g
• Spool Diameter：50(2inch)
• Wire Material：Glod wire(18~50μm)，Cu Wire，Palladiumplating,Copper wire, Alloy wire, Silver wire
• Bonding Speed：45ms/ wire cycle time
• Optical System：Programmable auto-zoom:2~4 times continuous zoom,6~3.6 times is optional
• Basic OS：Windows
• Weight：650Kg