Automatic Deep Access Wire Bonder MPE-6000-W

Specification

• Application：Discrete,Microwave module, Laser, Optical Communication Devices,  Sensors, MEMS, SAW, RF Components, Power Device, etc.
• Bonding Accuracy：±3μm@3sigma
• Bonding Area：Max area:305mmx457mm,rotation:0~220°
• Ultrasonic：0~4W control precision,support ramp mode 1mW resolution
• Loop Length and Loop Height：Programmable,fixed length and height loop control
• Device Depth：Max:16mm
• Bonding Force：0~220g
• Capillary Length：19mm/25mm
• Bonding Wire Type：Gold wire(18um~75μm), Al wire（18~75μm）
• Bonding Speed：≥5wires/s
• Operating System：Windows
• Weight：2T