Automatic Deep Access Wire Bonder MPE-6000-B

Specification

• Application：Discrete,Microwave module, Laser, Optical Communication Devices, Sensors, MEMS,  SAW, RF Components,  Power Device,  
• Bonding Accuracy：±3μm@3sigma
• Bonding Area：Max area:305mmx457mm,rotation:0~180
• Ultrasonic：0~4W control precision,support ramp mode 1mW resolution
• Loop Length and Loop Height：Programmable,fixed length and height loop control
• Device Depth：Max:12mm
• Bonding Force：0~220g
• Capillary Length：16mm/19mm
• Bonding Wire Type：Gold wire(18um~75um)
• Bonding Speed：≥4wires/s
• Operating System：Windows
• Weight：2T