Multifunctional Manual Wire Bonders MPE-450-B
No.MPE-450-B
Main Features
- Close loop force control
- EFO controlled by CPLD
- DSP phase lock,stable ultrasonic output
- Drive by electricity without compressed air
- Self-study Chinese GUl for advanced process
- Unique tailless bumping process and super adaptability for soft substrates
- Bond head designed by parallelogram support large module of deep access
Description
Specification
- Application：Discrete, Microwave Module, Laser, Optical Communication Devices, Sensors, MEMS, SAW,RF Components, Power Device, etc.
- Bond Wire：Au(15~75μm),Pt(18~25μm),Ag(18~50μm)
- Device Depth：Max:15mm
- Spool：1/2 inch or 2 inch
- Bond Head Z Range：19mm
- Bond Head X-Y Range：X=15mm,Y=15mm
- Lifting Table Z Range：0~19mm
- Lifting Table X-Y Range：268mm×273mm
- Bond Power：Numerical control,1000x subdivision
- Bond Force：0~250g
- Type of Bonding Tools：19mm/16mm
- Clamping Table：Maximum Temperature 200℃
- Weight：About 47kg
