Multifunctional Manual Wire Bonders MPE-450P-W
No.MPE-450P-W
Main Features
- High precision close loop force control (Accuracy within 1g)
- High stability of bond point
- One key switch frequency
- Drive by electricity without compressed air
- Unique tailless bumping process and super adaptability for soft substrates
- Bond head designed by parallelogram support large module of deep access
Description
Specification
- Application：Discrete, Microwave Module, Laser, Optical Communication Devices, Sensors, MEMS, SAW, RF Components, Power Device, etc.
- Bond Wire：Al(18~100μm),Au(15~75μm),Gold Ribbon(12.7x50μm~25.4x300μm),Specific alloy wire.
- Device Depth：Max:21mm
- Spool：1/2 inch or 2 inch
- Bond Head Z Range：19mm
- Bond Head X-Y Range：X=15mm,Y=15mm
- Lifting Table Z Range：0~19mm
- Lifting Table X-Y Range：268mm×273mm
- Bond Power：Numerical control,1000x subdivision
- Bond Force：0~250g
- Type of Bonding Tools：25mm/19mm
- Clamping Table：Maximum Temperature 200℃
- Weight：About 47kg
