Multifunctional Manual Wire Bonders MPE-450P-W

Specification

• Application：Discrete, Microwave Module, Laser, Optical Communication Devices, Sensors, MEMS, SAW, RF Components, Power Device, etc.
• Bond Wire：Al(18~100μm),Au(15~75μm),Gold Ribbon(12.7x50μm~25.4x300μm),Specific alloy wire.
• Device Depth：Max:21mm
• Spool：1/2 inch or 2 inch
• Bond Head Z Range：19mm
• Bond Head X-Y Range：X=15mm,Y=15mm
• Lifting Table Z Range：0~19mm
• Lifting Table X-Y Range：268mm×273mm
• Bond Power：Numerical control,1000x subdivision
• Bond Force：0~250g
• Type of Bonding Tools：25mm/19mm
• Clamping Table：Maximum Temperature 200℃
• Weight：About 47kg